Latest Project Activity

August 09, 2022

Board Thickness Effect on ATC Reliability II

Thermal fatigue requirements have always been a priority for the products of most high-reliability end users. Solder joints age and degrade during service and eventually fail by the common wear-out…

Member Meetings

October 12 @ 8:00 am - 5:00 pm

HDP Fall Member Meeting

hosted by Atotech

Most Recent News

June 23, 2022

High Density Packaging User Group Announces Grace Electron Membership

High Density Packaging (HDP) User Group is pleased to announce that Grace Electron Technology Co., LTD. (Grace Electron) has become a member. “Grace Electron is a […]