Name: Board Thickness II
Start: 2021-01-14T14:00:00-06:00
End: 2021-01-14T15:00:00-06:00

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Board Thickness II

January 14, 2021 @ 2:00 pm - 3:00 pm CST

« Cu Peel Strength Phase 2 Jan 14, 2021 project meeting
Photonic Soldering »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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