Latest Project Activity
March 17, 2022
“OEMs are requiring tighter backdrill stub length control at higher signal frequencies with Backdrill targeted under BGA, connectors, and DDR memory modules. Due to changes in localized copper density across…
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Most Recent News
May 10, 2022
High Density Packaging (HDP) User Group is pleased to announce that Daikin America, Inc. (Daikin) has become a member. “Daikin is a world leading manufacturer of […]
