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Latest Project Activity
New Project Launch
Two new phases of this project have been launched:
In parallel, Phase 3 will focus on gaining a deeper understanding of the low-loss characteristics observed in Phase 1. Selected final finishes will be applied to the same test coupons used in Phase 1, with close attention to the as-is copper surface roughness and the thickness of Au, Ag, and Pd layers directly on copper. We will analyze the increase in insertion loss across different frequency ranges.
About Us
HDP Annual Member Meeting
Save the date!
After three successful member meetings in 2025, planning for the HDP Annual Member Meeting is progressing. The meeting is scheduled for March 4 and 5, 2026, and will be hosted by Underwriters Laboratories (UL) in San Jose, CA.
In addition to the usual project updates, a keynote address will be delivered by Joe O’Neil, Principal OAA Ventures. The subject of the keynote is: The PCB Market Catalyst (PCBMC)
The PCB Market Catalyst (PCBMC) is designed to rapidly deploy UHDI manufacturing capability into the U.S. electronics industrial base and accelerate technology transition from development to production. In parallel, PCBMC is intended to expand the domestic electronics manufacturing base by aligning demand, process capability, workforce readiness, and manufacturability. By acting as a neutral public-private partnership (PPP), PCBMC will reduce adoption friction, compress learning curves, and enable broader access to advanced interconnect technologies that are currently capital-, talent-, and yield-constrained.
